Montage Tech planning US$1 billion Hong Kong IPO

Chinese chip designer Montage Technology has reportedly hired banks for a Hong Kong listing that could raise about US$1 billion (HK$7.8 billion),  Bloomberg reported.

The report, citing sources, said the company is planning a collaboration with China International Capital Corporation (3908), Morgan Stanley, and UBS. The negotiation is ongoing and the listing plan may change, the report said.

Founded in 2004, Montage is a data processing and interconnect chip design company dedicated to providing chip solutions for the cloud computing and artificial intelligence fields.

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